A) a thin layer of Ag is formed on Cu
B) more voltage is required
C) \[A{{g}^{+}}\]ions are completely removed from solution
D) less availability of \[A{{g}^{+}}\]ions, as Cu cannot displace Ag from \[{{[Ag(C{{N}_{2}})]}^{-}}\]ion
Correct Answer: D
Solution :
In the silver plating of copper,\[K[Ag{{(CN)}_{2}}]\] is used instead of \[\text{AgN}{{\text{O}}_{\text{3}}}\text{.}\]The reason is less availability of \[\text{A}{{\text{g}}^{+}}\]ions, as Cu cannot displace Ag from\[{{[Ag{{(CN)}_{2}}]}^{-}}\]ion.
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