A) a thin layer of Ag is formed on Cu
B) more voltage is required
C) \[A{{g}^{+}}\] ions are completely removed from solution
D) less availability of \[A{{g}^{+}}\] ions, as Cu cannot displace Ag from \[{{[Ag{{\left( CN \right)}_{2}}]}^{-}}\] ion
Correct Answer: D
Solution :
[d] In the silver plating of copper, \[K[Ag{{\left( CN \right)}_{2}}]\]is used instead of\[AgN{{O}_{3}}\]. Copper being more electropositive readily precipitate silver from their salt solution \[Cu+2AgN{{O}_{3}}\xrightarrow{{}}\text{ }Cu{{\left( N{{O}_{3}} \right)}_{2}}+Ag\] whereas in \[K[Ag{{(CN)}_{2}}]\] solution a complex anion \[{{[Ag{{(CN)}_{2}}]}^{-}}\] is formed and hence \[A{{g}^{+}}\] are less available in the solution and therefore copper cannot displace Ag from its complex ion.
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