A) a thin layer of Ag is formed on Cu
B) more voltage is required
C) \[A{{g}^{+}}\] ions are completely removed from solution
D) less availability of \[A{{g}^{+}}\] ions, as Cu cannot displace Ag from \[{{[Ag\,{{(CN)}_{2}}]}^{-}}\] ion
Correct Answer: D
Solution :
[d] In the silver plating of copper, \[K[Ag\,{{(CN)}_{2}}]\] is used instead of \[AgN{{O}_{3}}\]. The reason is less availability of Ag+ ions, as Cu cannot displace Ag from \[K\,[Ag{{(CN)}_{2}}]\] ion
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