A) a thin layer of \[Ag\] is formed on \[Cu\]
B) more voltage is required
C) \[A{{g}^{+}}\] ions are completely removed from solution
D) less availability of \[A{{g}^{+}}\] ions, as \[Cu\] cannot displace \[Ag\] from\[{{[Ag{{(CN)}_{2}}]}^{-}}\]ion
Correct Answer: D
Solution :
In the silver plating of copper, \[K[Ag{{(CN)}_{2}}]\] is used instead of \[AgN{{O}_{3}}\].The reason is less availability of \[A{{g}^{+}}\]ions, as \[Cu\] cannot displace \[Ag\]from \[K[Ag{{(CN)}_{2}}]\] ion.
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